12-November-2026
Corporate News
 
South Korea's Lee Says Samsung Chip Packaging Expansion to Spur $30 Billion Additional Investment
12-Nov-2026

South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.

News Source:- https://money.usnews.com/investing/news/articles/2026-11-11/south-koreas-lee-says-samsung-chip-packaging-expansion-to-spur-30-billion-additional-investment