Huawei Technologies said on Monday it will make industry-leading semiconductors using a new technology in five years, underscoring Beijing's efforts to neutralise U.S. sanctions that have made it hard for China to build cutting-edge chips. Huawei, in a semiconductor symposium in Shanghai, said its high-end chips will have transistor density equivalent to 1.4-nanometre processes by 2031, but did not provide independent performance data. The target is significant as China's most advanced proven chipmaking capability is widely seen at around 7 nanometres, while 1.4 nm is expected to be close to the global frontier for advanced chipmaking around the end of the decade.